| PROJEKTE |

EMSIG
BMWI Lead Project: Energy minimized system integration.   details  
Match-Druck
Development and manufacturing of LTCC based Packaging Solutions.
details
 ZEMI
Glas-ceramic foils and multilayer technology for packaging and passive integration in microsystem technology. Manufacturing and process optimiedd shaping of nanoscaled functional ceramic oxide powders.   details
IMODAS
Integration of Modular Driver Systems for Industrial Equipment Based on the "Microsystem Component Kit".  details

FANIMAT
Functional Inorganic Nonmetallic Materials.
details
ALMA              
Advanced LTCC Module Manufacturing Line for Automotive and Telecom Applications. 
details
ARHMS
Advanced RF Subsystems Exploiting High Power MEMS Switches. 
details
 


2010 - 2006      2005 -2002        2001 - 2000